Dla złącz JST ZH Złącza 1.50mm Złącze przewodu na płytkę Złącze PCB

For JST ZH Connector Alternatives 1.50mm Pitch Wire To Board Connectors PCB Connector

Szczegóły Produktu:

Place of Origin:	Dongguan, China(mainland)
Nazwa handlowa:	HRT
Orzecznictwo:	ISO9001/ ISO14001/UL/RoHS/REACH
Model Number:	A1500H-NP-HRT

Zapłata:

Minimum Order Quantity:	5000 pcs
Cena:	Negotiated
Packaging Details:	Bag with outside carton
Delivery Time:	5 to 8 working days after payment checked
Payment Terms:	TT, Western Union, PayPal, L/C
Supply Ability:	28 million pcs per month

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Szczegółowy opis produktu

kategorii:	Obudowy zaciskane	aplikacji:	Sygnał, połączenie między urządzeniami
materiał:	PA66	Łatwopalność:	UL94V-0
Zakres drutu:	AWG26 # do 32 #	Płeć:	Kobieta
High Light:	Connector Wire To Board , Board To Wire Connectors

1.25mm Pitch Circuit Board Wire Connectors With Lock Structure PA66 / LCP Material

1, The specification of the product including basic size information, electrical and mechanical properties.

Basic size information
Suitable terminals		A1500T series
Suitable wafer		A1500WR/WV series
Pitch		1.50mm
Color		white
Row		single
Lock to mating part		without
Circuits		2 to 14
Wire insulation diameter		1.15mm Max.
Terminal materials		phosphor bronze, tin-plated

Electrical properties
Current Rating		1A AC, DC
Voltage Rating		125V AC, DC
Contact Resistance		20mΩ Max
Insulation Resistance		100mΩ min
Withstanding Voltage		500V AC/minute

Mechanical properties
Temperature range		-25℃ to 85 ℃
Other information please kindly check the following picture.

2, Related drawing and report

Folllowing pictures are out testing report and exact engineering drawing for your information, please kindly check it, wish it can help you to get what you really need.

Dla złącz JST ZH Złącza 1.50mm Złącze przewodu na płytkę Złącze PCB

Revision Control

Rev.	ECN Number	Originator	Checked	Approval	Issue Date
B/0	New Release	Marike Deng	Kevin Chen	Jacky Qi	06/20/2010

Product Summary Test Report Origination

Originator by Date	Checked by Date	Approved by Date
Marike Deng 06/20/10’	Kevin Chen 06/20/10’	Jacky Qi 06/25/10’

This document is the property of Xin Pei Enterprise and delivered on the express condition that it is not be disclosed, reproduced or used, in whole or in part, for manufacture or sale by anyone other than Xin Pei Enterprise.

Without its prior consent, and that no right is granted to disclose or to use any information in this document.

1. Scope

This specification covers the requirements for product performance of 1.50mm pitch wire to board

connectors series.

2. Construction,Dimensions,Material & Plating

See the attached drawings

3. Ratings & Applicable Wires

Item	Standard
Rated Voltage (Max.)	100V AC/DC		Insulation O.D. 1.10mm (Max.)
Rated Current (Max.) And Applicable Wires	AWG#26	1A AC/DC
	AWG#28	1A AC/DC
	AWG#30	1A AC/DC
	AWG#32	0.8A AC/DC
Ambient Temperature Range	-25℃ ~ +85℃*

*: Including terminal temperature rise

4. Electrical Performance

Test Description		Procedure	Requirement
4-1	Contact Resistance	Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4)	20mΩ (Max.)
4-2	Insulation Resistance	Mate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B)	500MΩ (Min.)
4-3	Dielectric Withstanding Voltage	Mate connectors, apply 500V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301)	No Breakdown.
4-4	Contact Resistance on Crimped Portion	Crimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA.	5mΩ (Max.)

5. Mechanical Performance

Test Description		Procedure	Requirement
5-1	Actuator Insertion & Withdrawal Force	Insert and withdraw connectors at the speed rate of 25±3mm / minute.	Refer to paragraph 7
5-2	Crimping Pull Out Force	Fix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8)	AWG#26	2.0kgf (Min)
			AWG#28	1.0kgf (Min)
			AWG#30	0.8kgf (Min)
			AWG#32	0.5kgf (Min)
5-3	Terminal Insertion Force.	Insert the crimped terminal into the housing.	1.00kgf (Max.)
5-4	Terminal/Housing Retention Force.	Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing.	1.00kgf (Min.)
5-5	Pin Retention Force	Apply axial push force at the speed rate of 25±3mm / minute	0.70kgf (Min.)
5-6	Durability	When mated up to 50 cycles repeatedly by the rate of 10 cycle per minute.	Contact Resistance 40mΩ (Max.)
5-7	Vibration	Amplitude: 1.5mm P-P Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes. (Based upon MIL-STD-202 Method 201A)	Appearance No Damage. Contact Resistance 40mΩ (Max.) Discontinuity 1 μsec.(Max.)
5-8	Physical Shock	490m/s²｛50G｝,3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)

6. Environmental Performance And Others

Test Description		Procedure	Requirement
6-1	Temperature Rise	Carrying rated current load.(Based upon UL 498)	30℃(Max.)
6-2	Heat Resistance	85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-3	Cold Resistance	-25±3℃,96 hours (Based upon JIS C0020)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-4	Humidity	Temperature: 40±2℃ Relative Humidity : 90~95% Duration: 96 hours (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)	Appearance No Damage. Contact Resistance 40mΩ (Max.) Insulation Resistance 50MΩ (Min.) Dielectric Withstanding Voltage Must meet 4-3
6-5	Temperature Cycling	5 cycles of: a) -55℃ 30 minutes b) +85℃ 30 minutes (Based upon JIS C0025)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-6	Salt Spray	Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B)
6-7	SO2 Gas	24 hours exposure to 50±5ppm. SO2 gas at 40±2℃.
6-8	NH3 Gas	40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.

6-9

Solderability

Soldering Time: 5±0.5 sec.

Solder Temperature: 245±5℃

Solder Wetting 95% of immersed area must show no voids, pin holes

6-10

Resistance to Soldering Heat

(DIP)

Solder pot method

Soldering time: 10±0.5 sec.

Solder Temperature: 260±5℃

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

6-11

Resistance to Soldering Heat (SMT)

When reflowing

Refer to paragraph 8

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

7. Actuator Insertion/Withdrawal Force

[Unit : kgf]

Circuits	At Initial
Circuits	Insertion (Max.)	Withdrawal (Min.)
Single	0.70	0.06
02	2.50	0.40
03	3.00	0.50
04	3.50	0.60
05	4.00	0.70
06	4.50	0.80
07	5.00	0.80
08	5.50	0.90
09	6.00	0.90
10	6.50	1.00
11	7.00	1.00
12	7.50	1.20
13	8.00	1.20