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Dom ProduktyWafer Connector

1.25mm pitch SMT type wafer connector with PA6T material top entry type shrouded header

1.25mm pitch SMT type wafer connector with PA6T material top entry type shrouded header

    • 1.25mm pitch SMT type wafer connector with PA6T material top entry type shrouded header
    • 1.25mm pitch SMT type wafer connector with PA6T material top entry type shrouded header
    • 1.25mm pitch SMT type wafer connector with PA6T material top entry type shrouded header
  • 1.25mm pitch SMT type wafer connector with PA6T material top entry type shrouded header

    Szczegóły Produktu:

    Place of Origin: Dongguan, China(mainland)
    Nazwa handlowa: HRT
    Orzecznictwo: ISO9001/ ISO14001/UL/RoHS/REACH
    Model Number: A1250WV-S-NP

    Zapłata:

    Minimum Order Quantity: 5000 pcs
    Cena: negotiated
    Packaging Details: Bag with outside carton
    Delivery Time: 5 to 8 working days after payment checked
    Payment Terms: TT, Western Union, PayPal, L/C
    Supply Ability: 1.5 million pcs per month
    Skontaktuj się teraz
    Szczegółowy opis produktu
    Color: Yellow Pitch: 1.25mm
    Material: PA 6T Flammability: UL94V-0
    Row: Single Stackable: No
    High Light:

    Housing Connector

    ,

    Board In Connector

     

    1, The specification of the product including basic size information, electrical and mechanical properties.

     

    Basic size information
    Suitable housing A1250H series
    Category wafer
    Pitch 1.25mm
    Lock to mating part none
    Panel mount yes
    Pin material phosphor bronze/tin-plated
    Circuits 2 to 16pins
    Wire insulation diameter  0.90mm Max.
     
                                                           Electrical properties
    Current Rating 1A AC, DC
    Voltage Rating 125V AC, DC
    Contact Resistance 20mΩ Max
    Insulation Resistance 100mΩ min
    Withstanding Voltage 500V AC/minute
     
                                                            Mechanical properties
    Temperature range -25℃ to 85 ℃
                               Other information please kindly check the following picture.

                                            

    2, Related drawing and report

    Folllowing pictures are out testing report and exact engineering drawing for your information, please kindly check it, wish it can help you to get what you really need.

    1.25mm pitch SMT type wafer connector with PA6T material top entry type shrouded header

    1.25mm pitch SMT type wafer connector with PA6T material top entry type shrouded header

     

    Environmental Performance And Others

    Test Description Procedure Requirement
    6-1 Temperature Rise Carrying rated current load.(Based upon UL 498) 30℃(Max.)
    6-2 Heat Resistance 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    6-3 Cold Resistance -25±3℃,96 hours (Based upon JIS C0020)
    6-4 Humidity

    Temperature: 40±2℃

    Relative Humidity : 90~95%

    Duration: 96 hours

    (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    Insulation Resistance 10MΩ (Min.)

    Dielectric Withstanding Voltage Must meet 4-3

    6-5 Temperature Cycling

    5 cycles of:

    a) -55℃ 30 minutes

    b) +85℃ 30 minutes

    (Based upon JIS C0025)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    6-6 Salt Spray Tin-plated 16 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101C Cond. B)
    6-7 SO2 Gas

    24 hours exposure to 50±5ppm.

    SO2 gas at 40±2℃.

    6-8 NH3 Gas 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.
    6-9 Solderability

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 245±5℃

    Solder Wetting 95% of immersed area must show no voids, pin holes
    6-10

    Resistance to Soldering Heat

    (DIP)

    Solder pot method

    Soldering time: 10±0.5 sec.

    Solder Temperature: 260±5℃

    Solder iron method

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 370℃ ~ 400℃

    Appearance No Damage.
    6-11 Resistance to Soldering Heat (SMT)

    When reflowing

    Refer to paragraph 8

    Solder iron method

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 370℃ ~ 400℃

    Appearance No Damage.

    Actuator Insertion/Withdrawal Force

    [Unit : kgf]

    Circuits At Initial Circuits At Initial
    Insertion (Max.) Withdrawal (Min.) Insertion (Max.) Withdrawal (Min.)
    02 2.00 0.28 11 6.50 0.62
    03 2.50 0.30 12 7.00 0.65
    04 3.00 0.33 13 7.50 0.68
    05 3.50 0.38 14 8.00 0.71
    06 4.00 0.43 15 8.50 0.74
    07 4.50 0.48 16 9.00 0.77
    08 5.00 0.53 17 9.50 0.80
    09 5.50 0.56 18 10.00 0.83
    10 6.00 0.59      

     

    3, Our main Customer

    This product is widely used in household appliance, computer, communication device. Because we can controll NPL ratio under 1.15%, so our parts are accepted by famouse and international company like LeTV, Emerson, Amphenol Corporation, Skyworth, LuXshare, BYD etc. And the all products are certificated by REACH, UL, RoHS. In order to protect the evironment, some parts are halogen free.

    1.25mm pitch SMT type wafer connector with PA6T material top entry type shrouded header

    4,  Our service

    We have very good cooperation with international express company, and the can offer us good service and favorable price. It's sure that every business between us will be fast and happy. Choose us! Let's connect the realistic and electronic world.

     

     

    Szczegóły kontaktu
    RULETEAM CONNECTION TECHNOLOGY (SHENZHEN) CO.,LTD

    Osoba kontaktowa: Tienne Chen

    Tel: +8613711905178

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