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Dom ProduktyWafer Connector

Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

    • Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
    • Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
    • Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors
  • Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

    Szczegóły Produktu:

    Place of Origin: China
    Nazwa handlowa: HRT
    Orzecznictwo: ISO9001/ ISO14001/UL/RoHS/REACH
    Model Number: A1501 wafer

    Zapłata:

    Minimum Order Quantity: 5000 PCS
    Cena: Negotiated
    Packaging Details: Carton / Paper pots
    Delivery Time: 5 to 8 working days after payment checked
    Payment Terms: TT, Western Union, PayPal, L/C
    Supply Ability: 1000 pcs per day
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    Szczegółowy opis produktu
    Product Name: A1501WV / A1501WR Pitch: 1.50mm
    The Number of pin: 02PIN~15PIN Material: Pin: Brass/Tin-plated Wafer:PA6T
    Row: Single Fire-protection rating: UL 94V-0

     

    Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

     

    Description:

     

    1.A1501 series Wafer have A1501WV  A1501WR (Single row housing suitable A11501-T series terminal )

    2, Wafer used materials:PA6T , Fire-protection rating is UL 94-V0. Minimum packing quantity is 1000pcs/bag.

    3. Single  row Wafer we have 02PIN~15PIN ,The daily production capacity is 30 to 50 KPCS.

    4.Terminals are stamped by Phosphor Bronze, E-Stamping beforeTin-plated , Tin-plated we calling A1501-TPe , Minimum packing quantity is 20,000pcs/Reel. The daily production capacity is 300 to 400 KPCS.

    5.Terminals' wire range :AWG #22--#28insulation OD is0.90mm(Max).

     

     

    Test Description Procedure Requirement

    Contact Resistance

    Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4)    20mΩ (Max.)
    Insulation Resistance Mate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B)    1000MΩ (Min.)
    Dielectric Withstanding Voltage Mate connectors, apply 800V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301))    No Breakdown.
    Contact Resistance on Crimped Portion Crimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA.     5mΩ (Max.)

     

    Current rated      
         3A AC/DC maximum
    Voltage rated      350V AC/DC
    Withstand voltage      500V AC/minute
    Insulation resistance     1000MΩ min
    Contact resistance      20MΩ max
    Operating temperature      -25 - 85°C

     

     

     

    Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

    Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

    Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectorsWafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

     

    Environmental Performance And Others

     

    Test Description Procedure Requirement
    6-1 Temperature Rise Carrying rated current load.(Based upon UL 498) 30℃(Max.)
    6-2 Heat Resistance 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    6-3 Cold Resistance -25±3℃,96 hours (Based upon JIS C0020)
    6-4 Humidity

    Temperature: 40±2℃

    Relative Humidity : 90~95%

    Duration: 96 hours

    (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    Insulation Resistance 100MΩ (Min.)

    Dielectric Withstanding Voltage Must meet 4-3

    6-5 Temperature Cycling

    5 cycles of:

    a) -55℃ 30 minutes

    b) +85℃ 30 minutes

    (Based upon JIS C0025)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    6-6 Salt Spray Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101C Cond. B)
    6-7 SO2 Gas

    24 hours exposure to 50±5ppm.

    SO2 gas at 40±2℃.

    6-8 NH3 Gas 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.
    6-9 Solderability

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 245±5℃

    Solder Wetting 95% of immersed area must show no voids, pin holes
    6-10 Resistance to Soldering Heat

    Solder pot method

    Soldering time: 10±0.5 sec.

    Solder Temperature: 260±5℃

    Solder iron method

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 370℃ ~ 400℃

    Appearance No Damage.

     

    Actuator Insertion/Withdrawal Force

    [Unit : kgf]

    Circuits At Initial
    Insertion (Max.) Withdrawal (Min.)
    Single 0.70 0.06
    02 2.50 0.30
    03 3.00 0.40
    04 3.50 0.50
    05 4.00 0.60
    06 4.50 0.70
    07 5.00 0.80
    08 5.50 0.90
    09 5.50 1.00
    10 6.00 1.10
    11 6.00 1.20
    12 6.50 1.30
    13 6.50 1.40
    14 7.00 1.50
    15 7.00 1.60

     

    Szczegóły kontaktu
    Dongguan Xinpei Plastic & Metal Electronic Co. Ltd

    Osoba kontaktowa: Barry Fu

    Tel: +8618126033127

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