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Dom ProduktyWire to Board Connectors

Phosphor Bronze Terminal Connector, SMT Wire To Board Connectors MX 501189 wafer connector

Phosphor Bronze Terminal Connector, SMT Wire To Board Connectors MX 501189 wafer connector

    • Phosphor Bronze Terminal Connector, SMT Wire To Board Connectors MX 501189 wafer connector
    • Phosphor Bronze Terminal Connector, SMT Wire To Board Connectors MX 501189 wafer connector
    • Phosphor Bronze Terminal Connector, SMT Wire To Board Connectors MX 501189 wafer connector
  • Phosphor Bronze Terminal Connector, SMT Wire To Board Connectors MX 501189 wafer connector

    Szczegóły Produktu:

    Place of Origin: Dongguan, China(mainland)
    Nazwa handlowa: HRT
    Orzecznictwo: ISO9001/ ISO14001/UL/RoHS/REACH
    Model Number: A1003WV-S-2XNP

    Zapłata:

    Minimum Order Quantity: 5000 pcs
    Cena: USD0.001 to 0.005 per pcs
    Packaging Details: Tube(pipe) with outside paper carton
    Delivery Time: 5 to 8 working days after payment checked
    Payment Terms: TT, Western Union, PayPal, L/C
    Supply Ability: 28 million pcs per month
    Skontaktuj się teraz
    Szczegółowy opis produktu
    Color: Light-yellow Pitch: 1.0mm
    Wafer materials: PA6T, UL94V-0 Wire range: AWG32# to 28#
    Packaging Type: Tube Suitable housing: A1003 series dual row

    1, Detailed specification of product:

     

    1. Basic information:

    • Color: Light-yellow
    • Pitch: 1.00mm
    • Circuits: 16/20/30/32/40/50positions
    • Insulation O.D.: 0.80mm
    • Pin materials: Phosphor Bronze or gold flash
    • Solder tabs: Brass/Gold flash
    • Wafer material: Nylon6T,UL94V-0
    • Cap:Nylon6T,UL94V-0
    • Matched housing: A1003 series dual row
    • Mounting type: SMT
    • Application: Signal, wire to board
    • Terminal materials: Phosphor bronze
    • Finish terminal: Tin-plated or gold-flash type
    • Terminal Package: 15K pcs/reel
    • Terminal processing method: E-stamping before tin-plated

     

    2. Electrical characteristic:

    • Current Rating: 1A AC DC
    • Voltage Rating: 50V AC, DC
    • Contact Resistance: 20mΩ Max
    • Insulation Resistance: 100mΩ
    • Withstanding Voltage: 250V AC/minute

     

    3. Mechanical characteristic:

    • ​​Temperature Range:-25°C ~+85°C
    • Terminal Insertion Force: 0.50kgf (Max.)
    • Terminal/Housing Retention Force: 0.50kgf (Min.)
    • Pin Retention Force: 0.30kgf (Min.)

     

    Other detailed data please check the pictures as below.


     

    2, Introduction for this series products

    Please kindly notice these series product, you can buy it as a set, then we will offer you reasonable price.

                                                                  A1003 series product
                      Terminal A1003-T
     
                        Housing Dual housing A1003H-2XNP
    Single housing A1003H-NP
     
                         Wafer Dual rows type A1003WV-S-2XNP & A1003WVA-S-2XNP

     

     

    3, Corresponding engineering drawing & test report  

    Below file is our engineering drawing and testing report for further information. It's sure that it will be a

    good reference for you to know this series parts clearly.

     

                                                         Drawing of dimension                                                       

    Phosphor Bronze Terminal Connector, SMT Wire To Board Connectors MX 501189 wafer connector

    Phosphor Bronze Terminal Connector, SMT Wire To Board Connectors MX 501189 wafer connector

    5. Mechanical Performance

     

    Test Description Procedure Requirement
    5-1 Actuator Insertion & Withdrawal Force Insert and withdraw connectors at the speed rate of 25±3mm / minute. Refer to paragraph 7
    5-2 Crimping Pull Out Force Fix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8) AWG#28 1.0kgf (Min)
    AWG#30 0.5kgf (Min)
    AWG#32 0.3kgf (Min)
    5-3 Terminal Insertion Force. Insert the crimped terminal into the housing. 0.50kgf (Max.)
    5-4 Terminal/Housing Retention Force. Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing. 0.50kgf (Min.)
    5-5 Pin Retention Force Apply axial push force at the speed rate of 25±3mm / minute 0.30kgf (Min.)
    5-6 Durability When mated up to 50 cycles repeatedly by the rate of 10 cycle per minute. Contact Resistance 40mΩ (Max.)
    5-7 Vibration

    Amplitude: 1.5mm P-P

    Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes.

    (Based upon MIL-STD-202 Method 201A)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    Discontinuity 1 μsec.(Max.)

    5-8 Physical Shock 490m/s²{50G},3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)

     

     

    6. Environmental Performance And Others

     

    Test Description Procedure Requirement
    6-1 Temperature Rise Carrying rated current load.(Based upon UL 498) 30℃(Max.)
    6-2 Heat Resistance 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    6-3 Cold Resistance -25±3℃,96 hours (Based upon JIS C0020)
    6-4 Humidity

    Temperature: 40±2℃

    Relative Humidity : 90~95%

    Duration: 96 hours

    (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    Insulation Resistance 10MΩ (Min.)

    Dielectric Withstanding Voltage Must meet 4-3

    6-5 Temperature Cycling

    5 cycles of:

    a) -55℃ 30 minutes

    b) +85℃ 30 minutes

    (Based upon JIS C0025)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    6-6 Salt Spray Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101C Cond. B)
    6-7 SO2 Gas

    24 hours exposure to 50±5ppm.

    SO2 gas at 40±2℃.

    6-8 NH3 Gas 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.

     

    6-9 Solderability

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 245±5℃

    Solder Wetting 95% of immersed area must show no voids, pin holes
    6-10 Resistance to Soldering Heat

    When reflowing

    Refer to paragraph 8

    Solder iron method

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 370℃ ~ 400℃

    Appearance No Damage.

     

     

     

    7. Actuator Insertion/Withdrawal Force

    [Unit : kgf]

    Circuits At Initial
    Insertion (Max.) Withdrawal (Min.)
    Single 0.20 0.03
    2X08 3.40 0.49
    2X10 4.00 0.55
    2X15 5.50 0.70
    2X16 5.80 0.73
    2X20 7.00 0.85
    2X25 8.50 1.00

     

     

    4, FAQ

    Q1: Are you manufacturer or trading company?
    A: We are a manufacturer with 12 years experience professional manufacturing company which specializes in producing, research and development, sales of variety of electronic connectors, terminals, wafer etc.

    Q2: How to control the quality of your products?
    A: Quality is life of our company. The QC staff control each procedure as per ISO9001 program. All part are100% tested before shipping.

    Q3: Where is your factory located, and how can we visit there?
    A: Our company is located in Dongguan city, Guangdong Province, China. It is close to shenzhen

    Q4: How can I get the sample?
    A: The sample is for free,but the transportation fee will be beared by customers.

     

    Q5: What are your products applied to?
    A: Our products are applied to automotive use, conmmunication equipment, industrial use, household appliance, electronics, etc.

     

     

     

    Szczegóły kontaktu
    Dongguan Xinpei Plastic & Metal Electronic Co. Ltd

    Osoba kontaktowa: Barry Fu

    Tel: +8618126033127

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